Chemtronics CW7250, CircuitWorks Boron Nitride Thermal Paste, 3.4g Syringe
Boron Nitride – 3.4 g (0.12 oz.) syringe
CircuitWorks® Thermal Paste facilitates heat transfer away from electrical/electronic components. This heavy consistency material is thickened with a heat conductive filler to maintain a positive heat sink seal in electrical/electronic equipment.
Boron Nitride Thermal Paste (CW7250, CW7250KG)
- Provides maximum thermal conductivity with superior dielectric properties
- Silicone free compound will not harden or dry out
- Thermally stable from -99ºF (-73ºC) to 392ºF (200ºC)
- Exceeds MIL-C-47113 for Thermal Conductivity
FEATURES & BENEFITS
- Facilitates heat transfer between circuit components and heat sinks
- Excellent thermal and dielectric properties
- Will not dry out, harden, or melt
- Noncorrosive and nonflammable
Technical Data Sheet
Safety Data Sheet